Rebirth: Fight For Life

  Chapter 317 The cooperation plan of Flint Technology

   "The first thing to be clear is that Flint Technology's 3D flash memory technology involves two levels of 3Dization, storage units, and storage particle packaging."

   One sentence caused an uproar.

   "The three-dimensionalization and 3D packaging of the storage unit have been realized at the same time? Heaven..."

   Those who do encapsulation are even more invigorated. Although this package is not another package, who knows if there is any chance here?

Lin Yaodong opened the next slide, and Gu Song said: "We have completed the three-dimensional memory cell structure of four structures in the laboratory. According to the needs of patent application, the general ideas of these four structures will be published. Yes. Of course, now for the first time."

   The technical and business people in the audience didn't listen to him, and only focused on the four structural diagrams presented on the slide.

Gu Song waited for them to digest it for about ten seconds before approaching the microphone to increase the volume: "Please note that although the core details of the process will not be fully disclosed, based on foreign research foundations and their energy, at this moment they are sure I have already obtained the patent application materials that I submitted, and have been working on key problems in the laboratory."

The people in the audience turned their attention to Gu Song. Gu Song said: "There is not enough time. The good news now is that with four architectures and four sets of technologies, I am confident that at least at the patent level, foreign countries will be blocked. 3 -5 years. During this time, the possibility that they can find a fifth set of structures is very small. This means that in 3 to 5 years, we have to gain a firm foothold in the field of flash memory, and we have to make progress in the process technology. to catch up with world-class levels.”

  The field of flash memory has a firm foothold. Now that this technology is in hand, the problem is not big. But the process technology has caught up with the world-class level... Including Bao Ruozhang Rujing, the audience fell silent.

"As for the TSV packaging process, I have only completed the application for a full set of processes on flash memory chips. But of course, the application field of this packaging process is not limited to flash memory. Once foreign giants make breakthroughs in other fields, it will widen the gap in those fields. ."

   Zhang Rujing looked at the schematic diagram of the TSV packaging process on the slide and nodded heavily.

Gu Song said in a serious tone: "Everyone, let go of your prejudices and suppress some selfishness first. We cannot fully predict the inspiration of scientific research ideas and the extension of application fields brought by a new technology to foreign countries. At this time, if we can't unite and build a 3D flash memory factory first and gain a sufficient share in the global market, then this cake does not exist. I have patents in hand, and I don't want to expect foreign manufacturers to make the cake. Big, and then each family will give me a small bite."

"To make this cake bigger, we must first ensure that the world's largest and most advanced 3D flash memory production base will be in China in the future! Now, the 2D flash memory process technology has matured at the 130-nanometer level. This year's MLC architecture The 2D flash memory will be mass-produced and put on the market, and the 12-inch wafer production line will be used. But now, Flint Technology's 3D flash memory can only be considered in the 250nm or even 350nm process. inch wafers.”

Gu Song paused for a moment and said sincerely: "There are many difficulties, and the advantages are not as great as imagined, because our foundation is too poor. Even the most direct difficulty, the first batch of 3D flash memory, now wants to succeed in tape-out, it needs special Tackle key problems. Can I choose to go to Intel, Toshiba, or Samsung for joint R&D and mass production?"

   Looking at Gu Song's expression, the people in the audience finally woke up.

  Yes, the technology of 3D flash memory is indeed epoch-making. But now what everyone wants is a cake that can be eaten in the mouth. If it can't be mass-produced as soon as possible, what does this cake have to do with itself?

  If you want mass production, the equipment is worse than others, the craftsmanship is behind others, and there is not even a dedicated flash memory factory to jointly develop.

   Huaxin International's production line is the most advanced, but at the beginning of its establishment, it was a pure foundry as its development direction. Hua Hong's 8-inch production line can only achieve mature mass production of the 500-nanometer process. Belling Microelectronics is also struggling.

   Thinking about dividing the cake now is child's play?

   "This is the first difficulty that Xinhuo Technology is facing now. For the 8-inch wafer production line, try to complete the mass production of a complete set of processes at the 250-nanometer level. The equipment and team required are practical difficulties."

Gu Song nodded to Lin Yaodong, and entered the second link with the content of the slideshow: "I propose my solution. At the same time as the establishment of Xinhuo Technology, I want to choose a chip factory to cooperate with, 8-inch wafer, 250nm process. I will be in charge of the mass production process and try tape-out. This chip factory will obtain the permanent authorization of this set of architecture and the first-generation process, and will mass-produce its own 3D flash memory under an independent brand in the future.”

   Zhang Rujing and representatives of Hua Hong and Belling Microelectronics all showed their expectations. 8-inch production line, 250nm process, their production line can meet the basic conditions.

Gu Song did not wait for them to digest, and continued: "As for Xinhuo Technology, I want to directly use the 12-inch wafer and 130-nanometer process. For the first-generation equipment required, I will come up with a second set of architecture and a large foreign factory. In the same way, what I exchanged abroad is also based on the first-generation process of 8-inch wafer and 250nm process. I am not responsible for the mass production process. This plan is not absolute. If any chip factory here has the ability to directly introduce this technology If a production line is exchanged for me, then I don’t have to give foreign authorization. This production line is equivalent to the permanent transfer of a set of architecture and first-generation process patents.”

"Everyone, if it is possible, I don't want the mass production of 3D flash memory to be realized abroad first. But also, I don't want to start from the basis of 8-inch wafers and 250nm, and go to 12-inch wafer production line with others at 130nm. Mass-produced MLC chips at nano or even 90 nanometers compete.”

   Zhang Rujing smiled wryly, a set of 12-inch production line and equipment that can realize 130nm process technology, to permanently exchange a set of 3D flash memory patents, of course, it is worthwhile, I am afraid that foreign factories will be difficult to refuse. However, the conditions that Gu Song gave them were definitely not as generous as those given to domestic companies, and they must have some other requirements.

   But he exhausted his efforts and only introduced an 8-inch wafer production line. 12-inch wafer production line...where can I get it? This is a wafer production line that has just matured into mass production in 2001.

  Han Jingwei whispered to Wang Bang about the difficulty of introducing 12-inch wafer production, and Wang Bang also looked serious.

   "After talking about the difficulties of equipment, let's talk about the difficulties of people. The person in charge of Xinhuo Technology, I have confirmed it. Liao Qingshan, the production director of Wanxi Power Plant, has decided to join Xinhuo Technology."

   Zhang Rujing suddenly raised his head and stared at Gu Song.

  The action is so fast, Liao Qingshan... This is an old acquaintance, the backbone of SMC, and is regarded as a figure trained by the next generation of leadership. Was dug up so soon?

   "It's meaningless if there are generals but no soldiers." Gu Song glanced at Zhang Rujing, "The craftsmanship at the time of tape-out, two sets of people participating and learning together, this is my cooperation requirement."

"In terms of future plans, let's put it on hold for now. Cooperative tape-out, helping Xinhuo Technology to introduce a 12-inch wafer production line and 130-nanometer process equipment, if you have any ideas, let's talk about it first. ."

  Under the stage, the leaders of Huhai City and Zhang Rujing took the lead to stand up...

   (end of this chapter)